Product Summary

The MT29C8G96MAZBADKD-5 WT is a micron package-on-package (PoP) MCP. The MT29C8G96MAZBADKD-5 WT is packaged with separate interfaces (no shared address, control, data, or power balls). This bus architecture supports an optimized interface to processors with separate NAND Flash and Mobile LPDRAM buses. The NAND Flash and Mobile LPDRAM devices have separate core power connections and share a common ground (that is, VSS is tied together on the two devices). The bus architecture of this device also supports separate NAND Flash and Mobile LPDRAM functionality without concern for device interaction.

Parametrics

MT29C8G96MAZBADKD-5 WT absolute maximum ratings: (1)Voltage input (1.8V): -0.6 to 2.4 V; (2)Voltage input (3.3V): -0.6 to 4.6 V; (3)Storage temperature range: -65 to 150 °C; (4)VCC supply voltage (1.8V): -0.6 to 2.4 V; (5)VCC supply voltage (3.3V): -0.6 to 4.6 V; (6)Short circuit output current, I/Os: 5 mA.

Features

MT29C8G96MAZBADKD-5 WT features: (1)Micron-NAND Flash and LPDDR components; (2)RoHS-compliant, green package; (3)Separate NAND Flash and LPDDR interfaces; (4)Space-saving multichip package/package-on-package combination; (5)Low-voltage operation (1.70+/-0.95V); (6)No external voltage reference required; (7)No minimum clock rate requirement; (8)1.8V LVCMOS-compatible inputs; (9)Programmable burst lengths; (10)Partial-array self refresh (PASR); (11)Deep power-down (DPD) mode; (12)Selectable output drive strength; (13)STATUS REGISTER READ (SRR) supported.

Diagrams

MT29C8G96MAZBADKD-5 WT dimension figure