(China (Mainland))
Product Summary
The MT29F32G08AECBBH1-12:B is a 168-Ball NAND Flash and LPDRAM PoP (TI OMAP) MCP. Micron package-on-package (PoP) MCP products combine NAND Flash and Mobile LPDRAM devices in a single MCP. The MT29F32G08AECBBH1-12:B targets mobile applications with low- power, high-performance, and minimal package-footprint design requirements. The MT29F32G08AECBBH1-12:B is also members of the Micron discrete memory products portfolio.
Parametrics
MT29F32G08AECBBH1-12:B absolute maximum ratings: (1)Vcc, Vdd, Vddq supply voltage relative to Vss, Vcc, Vdd, Vddq: –1.0 to 2.4 V; (2)Voltage on any pin relative to Vss, Vin: –0.5 to 2.4V or (supply voltage1 +0.3V), whichever is less; (3)Storage temperature range: –55 to +150℃.
Features
MT29F32G08AECBBH1-12:B features: (1)Micron NAND Flash and LPDRAM components; (2)RoHS-compliant, green package; (3)Separate NAND Flash and LPDRAM interfaces; (4)Space-saving multichip package/package-on-package combination; (5)Low-voltage operation (1.70–1.95V); (6)Industrial temperature range: –40 to +85℃.
Diagrams
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 MT29F32G08AECBBH1-12:B |
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IC FLASH NAND 32GB 100VBGA |
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IC FLASH NAND 1GB 130VFBGA |
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MT29C1G12MAACAFAMD-6 IT |
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MT29C1G12MAACAFAML-6 IT |
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IC FLASH NAND 1GB 153VFBGA |
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