Product Summary

The MT29F4G16ABCWC:C is a micron package-on-package (PoP) MCP. The MT29F4G16ABCWC:C is packaged with separate interfaces (no shared address, control, data, or power balls). This bus architecture supports an optimized interface to processors with separate NAND Flash and Mobile LPDRAM buses. The bus architecture of this device also supports separate NAND Flash and Mobile LPDRAM functionality without concern for device interaction. Operational characteristics for the NAND Flash and Mobile LPDRAM devices are found in the standard Micron data sheets for each of the discrete devices.

Parametrics

MT29F4G16ABCWC:C absolute maximum ratings: (1)Vcc, Vdd, Vddq supply voltage relative to Vss: -1.0 to 2.4 V; (2)Voltage on any pin relative to Vss: -0.5 to 2.4 V; (3)Storage temperature range: -55 to 150 °C.

Features

MT29F4G16ABCWC:C features: (1)Micron-NAND Flash and LPDRAM components; (2)RoHS-compliant, green package; (3)Separate NAND Flash and LPDRAM interfaces; (4)Space-saving multichip package/package-on-package combination; (5)Low-voltage operation (1.70+/-0.95V); (6)No external voltage reference required; (7)No minimum clock rate requirement; (8)1.8V LVCMOS-compatible inputs; (9)Programmable burst lengths; (10)Partial-array self refresh (PASR); (11)Deep power-down (DPD) mode; (12)Selectable output drive strength; (13)STATUS REGISTER READ (SRR) supported.

Diagrams

MT29F4G16ABCWC:C dimension figure

Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
MT29F4G16ABCWC:C
MT29F4G16ABCWC:C


IC FLASH 4GBIT 48TSOP

Data Sheet

Negotiable 
MT29F4G16ABCWC:C TR
MT29F4G16ABCWC:C TR


IC FLASH 4GBIT 48TSOP

Data Sheet

Negotiable